Digit-Concept

SLP 500DC+


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SesameLASERPLASMA500DC+

The most efficient equipment in the market for

IC decapsulation and cross sections


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Product Highlight

The SLP500DC+ integrates a 20W IR Fiber LASER on basis

  • True 3 in 1 system: The SLP500DC+ allows to perform IC decapsulator, PCB cutting, samples cross-section

  • Flexible and Reliable : The SLP500C+ keeps all the advantages and benefits of the SLP500DC

  • Easy and Safe: The SLP500DC+ is a compact system. Easy to move, Safe with its new automatic door.

Specifications

  • IC decapsulation, PCB cutting, ICs cross sections
  • Laser ablation area up to 170x170mm with the 254mm lens
  • Atmospheric Plasma AssistedTM to avoid corrosion (*1)
  • Compatible with Au, Al, Cu, Cu/Pd, Ag wires
  • Quick focus with its lateral camera
  • Real time vision during ablation
  • Wide choice of FOV
  • Easy to use with its 2 intuitive software: Basic and Expert
  • Precise decapsulation using Xray and SAM images
  • Design your own gasket
  • Small footprint and easy to move
  • Fast upgrade on site

OPTIONS

  • Through Galvo-Head Camera
  • Cooler blast and cold table to reduce impact of temperature elevation of the die, fix the package and reduce ESD
  • Programmable X-Y table : 50x50mm or 100x100mm

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