SA777 : From +10°C to +250°C
The first acid decapsulator made for copper... but not only.
The SA777 is an Automated Mixed Acid Decapsulator based on SA707, with advanced feature integration to enable high productivity. This Decapsulator rapidly and easily opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or acid mixes to the package with no sample damage.
The delivery of each micro-aliquot is done with sufficient pressure to create extreme turbulence in the etched cavity that greatly accelerates the rate of encapsulant removal. Very low, precise acid temperatures, combined with high micro-aliquot delivery rates allow for the decapsulation of copper wired devices with no wire or metallization damage.
An exclusive acid delivery function can be selected that delivers the highest pulse rate possible while consuming less than maximum acid volume. The specially designed acid heat exchanger can accurately control acid temperature down to 10°C and up to 250°C, with flow rates to 8 ml. per minute. The high acid pulse rates achieve reasonable etch times even at the lowest temperatures.
The monolithic etch head is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process.