A high-pressure dispensing pump sprays the device being cleaned with different cleaning solutions while the device is rotated at high speed. The force of the spray dislodges debris from the grinding, lapping, and polishing process while the rotation of the part removes this debris from the die surface.

Both waste liquids and debris drain into a waste bottle located on the side of the unit next to the solution source bottles.

A typical cleaning process has a source bottle containing D.I. water and another containing a solvent e.g. isopropanol.

The part to be cleaned, while mounted to its holding fixture, is placed on the spindle and the safety cover closed. The part is spun at the programmed RPM and the pump dispenses the solvent for a programmed time. The device is then rinsed with D.I. water and finally dried with either dry nitrogen gas or compressed air.

The entire process occurs in a closed chamber eliminating any safety issues resulting from an improperly mounted device.

The device and its holding fixture are always cleaned together, thus eliminating the need to re-mount the device. This of course reduces the chance of transferring any diamond particles into the next "backside" processing step. A special process is included that allows for spinning of the device without any dispensing of cleaning liquids. This process can be used for applying anti-reflective coatings on a die that has been completely polished.