DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP).
After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag ...).
The SLP500DC is based on our SL500DC platform. It combines a high performance IR Fiber LASER with Radio Frequency or Micro Wave Plasma (RFP/MWP). This SLP is based on our joint patent with the CNES Toulouse (Fr) - WO 2008/090281.
The SLP500DC provide 3 technics to solve mainly all your needs
Atmospheric Radio Frequency Plasma (ARFP) and Micro Wave Plasma (AMWP)
Vacuum Radio Frequency Plasma (VRFP) and Micro Wave Plasma (VMWP)
Control of the Plasma obtained from the LASER ablation process
3 in 1 system: The SLP500DC is our third LASER IC decapsulator basic platform. It can also integrate a cross section option for ICs, modules and PCBs. In addition, a Plasma option module can be added to become the SLP500DC
Flexible and Reliable : The SLP500C integrates a 10W IR Fiber LASER on basis. 4 Power LASER and 4 lenses are available to meet all you requirements. The SLP500DC is equipped with a Live vision camera with Fast Z adjustment and a Coaxial camera with High Mag and FOV on request. The SLP500DC have a 2 years Warranty.
Easy and Safe: The SLP500DC is a compact system, very easy to move. It can be installed everywhere in a workshop or on a production line and needs a simple mono-phased electric plug 110/220V - 50/60Hz. Plug it, you are ready to start
SLP500DC, THE FLEXIBILITY TO SUIT YOUR APPLICATION