Digit-Concept

SLP 500DC


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SesameLASERPLASMA500DC

​The Best Quality/Price ratio of

​the decapsulation Equipment in the market


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Product Highlight

DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP).

  • After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag ...). 
  • The SLP500DC is based on our SL500DC platform.  It combines a high performance IR Fiber LASER with an Atmospheric Plasma Assisted to avoid corrosion.This SLP is based on our joint patent with the CNES Toulouse (Fr) - WO 2008/090281.

SLP500DC Platform

  • 3 in 1 system: The SLP500DC allows to perform IC decapsulator, PCB cutting(*1) , samples cross-section(*1)

  • Flexible and Reliable : The SLP500C integrates a 10W IR Fiber LASER on basis. Laser or Lens upgrades are available to meet all you requirements. The SLP500DC is equipped with a Live vision camera with Fast Z adjustment and a Coaxial camera with High Mag and FOV on request.

  • Easy and Safe: The SLP500DC is a compact system, very easy to move. It can be installed everywhere in a workshop or on a production line and  needs a simple mono-phased electric plug 110/220V - 50/60Hz. Plug it, you are ready to start

SLP500DC, THE FLEXIBILITY TO SUIT YOUR APPLICATION

 

(*1) required the cross section LASER option

Specifications

  • Laser ablation area up to 170x170mm with the 254mm lens
  • Atmospheric Plasma AssistedTM to avoid corrosion (*1)
  • Compatible with Au, Al, Cu, Cu/Pd, Ag wires
  • Quick focus with its lateral camera
  • Real time vision during ablation
  • Wide choice of FOV
  • Easy to use with its 2 intuitive software: Basic and Expert
  • Precise decapsulation using Xray and SAM images
  • Design your own gasket
  • Small footprint and easy to move
  • Fast upgrade on site

OPTIONS

  • LASER Cross-Section
  • Through Galvo-Head Camera
  • Cooler blast and cold table to reduce impact of temperature elevation of the die, fix the package and reduce ESD
  • Programmable X-Y table : 50x50mm or 100x100mm

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